- Titel
- Out-of-Plane Mirrors for Single-Mode Polymeric RDL using Direct Laser Writing
- Zitierfähige Url:
- https://nbn-resolving.org/urn:nbn:de:bsz:14-qucosa2-880217
- Konferenz
- Electronics System-Integration Technology Conference (ESTC). Sibiu, Rumänien, 13.09.2022 -16.09.2022
- Quellenangabe
- IEEE 9th Electronics System-Integration Technology Conference (ESTC)
Erscheinungsort: Sibiu, Romania
Verlag: IEEE
Erscheinungsjahr: 2022
Seiten: 398-404 - Erstveröffentlichung
- 2022
- Abstract (EN)
- The growing demand for the Internet of Things (IoT) and Artificial Intelligence (AI) need high-speed commu-nication within short-range distances. In the Back-End-Of-Line (BEOL), Single-Mode Waveguide (SMW) with micro-mirror shows the promising application as an Optical Redistribution Layer (O-RDL) connecting photonic-chip at the interposer-level. The presented study shows the potential application of the 2-Photon-Polymerization (2PP) process for fabrication of out-of-plane coupling elements (micro-mirror) for SMW using low-loss Ormocer® hybrid polymers. This fabricated micro-mirror uses as a coupling element to connect the light from RDL to chips or for inter-layer connections at Interposer level. To evaluate the processing time, structural quality, and resolution of the printed micro-mirror, two types of lenses (63x and 25x) and Ormocer® polymers (OrmoComp and OrmoCore) were used. The optimization of the process flow for the micro-mirrors for SMW applications will be described in detail.
- Andere Ausgabe
- Link zum Artikel, der zuerst in der IEEE Xplore Digital Library erschienen ist.
DOI: 10.1109/ESTC55720.2022.9939534 - Freie Schlagwörter (EN)
- micro-mirror, 2PP-DLW (2-Photon- Polymerization Direct-Laser-Writing), BEOL (Back-End- Of-Line), SMW (Single-Mode-Waveguide), O-RDL (Optical- Redistribution Layer), Hybrid polymer
- Klassifikation (DDC)
- 620
- Verlag
- IEEE, New York
- Förder- / Projektangaben
- Bundesministerium für Bildung und Forschung (BMBF)
Vertrauenswürdige Elektronik (ZEUS)
Heterogene Photonik Elektronik Plattform für vertrauenswürdige quelloffene Prozessoren
(SILHOUETTE)
ID: 16ME0315 - Version / Begutachtungsstatus
- angenommene Version / Postprint / Autorenversion
- URN Qucosa
- urn:nbn:de:bsz:14-qucosa2-880217
- Veröffentlichungsdatum Qucosa
- 14.11.2023
- Dokumenttyp
- Konferenzbeitrag
- Sprache des Dokumentes
- Englisch
- Lizenz / Rechtehinweis
